ARP Capabilities


ARP has assembled a sound team with excellent background and adequate equipment base to carry out cutting edge research and product development. In its Harrisburg facility ARP has organized a 1000 sq. ft. lab space for “front-end” wafer processing and terahertz research. In house equipment base includes spin-coating station, laser test bed setup, terahertz emitter fabrication, HV poling setup with temperature control, electro-optic setup, wafer characterization setup, an automated setup for EOC measurements. All processes are monitored with real-time computer controlled data acquisition systems. Lithography portion of the tasks are conducted at the Penn State University’s Nanofabrication facility. ARP in-house facility also includes thin-film fabrication on wafer and other substrates, design and simulation of waveguide devices, CAD, art work for mask writing, prototyping and testing. For more information please contact: info@arphotonics.net.

Following is a partial list of capabilities and setups. Click on individual item for details.

Wafer Front-End Process

Wafer Inspection

Integrated Photonic Design and Simulation

Photonics Packaging

Photonic Test and Measurements

Laser and terahertz test bed

Electro-optic setup

Terahertz Spectrometer

Spectral Characterization

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Applied Research & Photonics, Inc.